Thermo Scientific ELITE System

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The Thermo Scientific ELITE System is a precision fault isolation platform designed for rapid, non-destructive defect localization in semiconductor devices and electronic assemblies. Utilizing advanced infrared lock-in thermography and a highly sensitive InSb detector, the system can identify extremely small thermal signatures associated with leakage currents, short circuits, and other electrically active defects. Its optimized optical architecture and noise suppression technology enable accurate thermal fault detection, while optional laser scanning microscopy further improves localization precision. By accelerating defect identification and root-cause analysis, the ELITE System provides valuable support for semiconductor failure analysis, reliability investigations, and process improvement activities.

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Key FeaturesTechnical SpecificationsApplications

High-resolution lock-in thermography enables precise localization of thermally active defects.
A highly sensitive InSb detector and advanced noise suppression technology allow detection of extremely weak thermal emissions.
Optional laser scanning microscopy enhances fault localization accuracy and defect correlation.
Integrated laser marking streamlines subsequent failure analysis workflows and sample navigation.

Parameter	Specification
Infrared Detector	InSb Detector
Spectral Response Range	3 μm – 5 μm
Imaging Resolution	640 × 512 pixels
Maximum Frame Rate	> 300 Hz
Temperature Sensitivity	< 1 mK
Noise Equivalent Temperature Difference (NETD)	< 15 mK
Minimum Detectable Power	1 μW

The Thermo Scientific ELITE System is widely used for thermal emission microscopy and fault localization in semiconductor devices, advanced packaging structures, and electronic assemblies. Typical applications include:

Localization of wire-bond and package-related defects
Detection of internal chip interconnect shorts
Identification of oxide layer leakage and dielectric failures
Analysis of transistor and diode leakage mechanisms
Failure localization in TFT-LCD panels
Detection of metal line defects and short circuits in PCB and PCBA assemblies
Investigation of electrostatic discharge (ESD) and latch-up related failures
Depth estimation of failure sites in stacked-die and 3D packaging structures
Non-destructive fault localization in packaged devices without decapsulation
Analysis of low-resistance short-circuit failures (<10 Ω)

The system can also estimate the depth of thermal sources under certain conditions, providing valuable information for subsequent physical failure analysis and cross-sectional investigations.

By integrating advanced infrared lock-in thermography, precision defect localization, laser-assisted inspection, and marking capabilities into a single workflow, the instrument can efficiently support semiconductor manufacturers, packaging providers, electronics companies, and research organizations. This enhanced capability accelerates root-cause investigations, improves failure analysis success rates, and supports quality assurance, process optimization, and reliability assessment throughout the product development and manufacturing lifecycle.

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