HAMAMATSU PHEMOS-X Emission Microscope

Inquiry

Through our global network of testing experts and analytical equipment including chromatography (HPLC, GC, GC/MS) and atomic absorption spectroscopy (AAS, GFA, FIAS), Our goal is to provide test services as efficiently as possible to maximize our customers' profits. For more information about our services, contact one of our experts today.

Note: this service is for Research Use Only and Not intended for clinical use.

The HAMAMATSU PHEMOS-X Emission Microscope is an advanced failure analysis system designed for the localization of defects in semiconductor devices. By detecting extremely weak light emissions and thermal emissions generated by device failures, the system enables engineers and researchers to accurately identify fault locations within complex semiconductor structures.

To achieve high-precision defect localization, the system integrates high-resolution optical imaging, ultra-sensitive emission detection technology, and multiple analytical techniques within a single platform. Its multi-wavelength laser configuration enables emission analysis across a broad spectral range from visible light to near-infrared wavelengths, providing comprehensive insights into device failure mechanisms and supporting efficient semiconductor failure analysis and process optimization.

Request a Test See More Details

Key FeaturesBasic Display FunctionsApplications

The PHEMOS-X can be equipped with two ultra-high sensitivity cameras, allowing selecting the most appropriate detection method according to the sample type and failure mode. This flexibility supports both emission analysis and thermal analysis across different wavelength ranges.
The system incorporates multi-wavelength laser architecture capable of supporting visible and near-infrared investigations within a single instrument. Multiple light sources can be installed to facilitate advanced failure analysis techniques such as OBIRCH, DALS, EOP, and laser marking.
The stage offers a working range of ±20 mm in both X and Y directions and up to +80 mm in the Z direction, enabling efficient examination of a variety of device configurations.
The optional TD imaging function is particularly useful for identifying defects in complex semiconductor structures, including logic devices containing internal metal features. This capability enhances defect localization in structures that may be challenging to analyze using conventional optical techniques.

Image Overlay Display: Emission images can be superimposed on optical pattern images, enabling rapid correlation between detected signals and device structures for accurate fault localization.
Contrast Enhancement: Integrated image enhancement tools improve the visibility of weak emission signals, making subtle defects easier to identify.
Multi-Window Visualization: The software supports simultaneous display of multiple image types, including pattern, emission, overlay, and reference images, allowing more efficient analysis and comparison.
Annotation and Measurement Tools: Built-in functions such as scale bars, grids, markers, and image annotations facilitate result interpretation, documentation, and reporting.

The HAMAMATSU PHEMOS-X is widely used in semiconductor research, development, and manufacturing environments. Typical applications include:

Semiconductor device failure localization
Integrated circuit (IC) defect analysis
Process development and yield improvement
Reliability investigation of advanced semiconductor devices
Detection of emission and thermal anomalies associated with device failures
Analysis of complex logic devices and structures containing internal metal layers using TD Imaging technology

Its combination of high sensitivity and advanced imaging capabilities makes it particularly valuable for identifying root causes of device malfunction and supporting continuous process optimization.

HAMAMATSU PHEMOS-X Emission Microscope significantly strengthens semiconductor failure analysis capabilities. By integrating high-resolution emission microscopy, thermal analysis, multi-wavelength laser functionality, and advanced defect localization technologies into a single platform, the HAMAMATSU PHEMOS-X enables faster and more accurate identification of failure mechanisms in modern semiconductor devices. It supports customers throughout the semiconductor product lifecycle, from R&D and process qualification to reliability assessment and root-cause investigation.

Leverage This Instrument for Advanced Testing

Recommendation
Ordering Process
Ask a Question

Do not know how to place an order, please refer to the flow chart shown below.

Submit quotation request

A technical manager will contact you within 24 hours

You will review and approve the final price and place an order

Confirm with you and make the payment

Instruct you to ship your samples and form

Analytic report delivery

If you have questions at any time during the process, just give us a call or send us an email at . We will do all we can to meet your needs.

Online Inquiry

Please fill out the form below and our experts will give you feedback within 36 hours.
If it is urgent, you can contact us directly through the contact information below.
Email:
Contact Information
Company / Organization:
Contact Name:
Title:
Address1:
Address2:
City:
State/Province:
Zip/Postal Code:
Country:
Phone:
Fax:
* Email:
Testing Information
* Type of Test:
* Number of Samples:
* Sample State:
Sample Source:
Test Items:
Other Description:
How Did You Hear About Us:
* Verification Code

KEEP UP TO DATE

Subscribe to our newsletter and follow us on social media

Alfa Chemistry Testing Lab WeChat QR code