ZEISS Xradia 620 Versa X-Ray Microscope

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Note: this service is for Research Use Only and Not intended for clinical use.

The ZEISS Xradia 620 Versa is a high-resolution X-ray microscopy (XRM) system designed for non-destructive three-dimensional (3D) and four-dimensional (4D) characterization of materials and components. Combining submicron imaging performance with advanced tomography capabilities, the system enables researchers and engineers to visualize, measure, and analyze internal structures without sectioning or damaging the sample. It also maintains exceptional imaging resolution even at large working distances, allowing the analysis of larger samples and the integration of environmental chambers or in-situ testing devices without compromising image quality.

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Key FeaturesTechnical SpecificationsApplications

Equipped with a 25 W micro-focus X-ray source operating from 30–160 kV, enabling high-quality imaging across a wide range of materials and sample densities.
Delivers spatial resolution of up to 500 nm, allowing detailed visualization of internal microstructures, defects, and complex geometries.
Features ZEISS's unique two-stage magnification architecture, providing exceptional image quality at large working distances while accommodating larger samples and in-situ devices.
Fully automated control of filters, detectors, objectives, and reconstruction processes ensures efficient operation, high repeatability, and reliable results.
Supports a wide variety of sample sizes and geometries with stage travel ranges of X: 50 mm, Y: 100 mm, and Z: 50 mm, making it suitable for diverse research and industrial applications.
Compatible with integrated in-situ testing stages, enabling real-time observation of material behavior under mechanical, thermal, or environmental conditions.
Powered by Dragonfly Pro for advanced 3D visualization, segmentation, quantitative analysis, and high-quality data interpretation.

Parameter	Specification
Spatial Resolution	Up to 0.5 μm
Minimum Voxel Size	40 nm
Resolution at Working Distance	Up to 1 μm
X-ray Voltage Range	30 – 160 kV
X-ray Source Power	25 W
Sample Size	Up to 300 mm
Maximum Sample Weight	Up to 25 kg
Stage Travel Range	X: 50 mm, Y: 100 mm, Z: 50 mm
Imaging Capability	3D and 4D X-ray Microscopy
Reconstruction & Operation	Fully Automated

The ZEISS Xradia 620 Versa serves a broad spectrum of industries and research disciplines where internal structural characterization is critical.

Industrial Quality Inspection: Used for non-destructive defect detection, dimensional measurement, wall thickness analysis, and quality control of industrial components and assemblies.
Electronics and Semiconductor Analysis: Enables high-resolution inspection of solder joints, TSVs, microbumps, bond lines, and other critical semiconductor packaging features.
Materials Research: Supports 3D characterization of metals, polymers, ceramics, and composites, including porosity, cracks, inclusions, and fiber orientation analysis.
Energy Materials: Provides detailed imaging of batteries, fuel cells, and other energy materials to evaluate internal structures and degradation behavior.
In-Situ Studies: Allows real-time observation of material changes under mechanical, thermal, or environmental conditions for advanced research and failure analysis.

ZEISS Xradia 620 Versa delivers more comprehensive analytical solutions for customers in electronics, aerospace, automotive, energy storage, advanced manufacturing, polymers, composites, and metallurgical industries. From routine quality control to cutting-edge research and development, the ZEISS Xradia 620 Versa helps accelerate innovation while reducing the need for destructive testing and costly sample preparation.

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