Malvern ANalytical X'Pert³MRD XL

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The Malvern Panalytical X'Pert³ MRD XL is a high-performance X-ray diffraction (XRD) system designed for advanced materials research, thin-film characterization, and semiconductor metrology. Building on the long-established materials research diffractometer (MRD) platform, it delivers enhanced measurement accuracy, system reliability, and analytical flexibility for demanding research and industrial applications. With the capability for full wafer mapping and a modular architecture, the X'Pert³ MRD XL provides an efficient solution for laboratories requiring high-resolution diffraction measurements across a wide variety of material systems.

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Key FeaturesTechnical SpecificationsApplications

High-resolution XRD system capable of full wafer mapping for samples up to 200 mm.
Precision horizontal goniometer equipped with Heidenhain optical encoders for exceptional angular accuracy, repeatability, and long-term measurement stability.
Advanced incident beam components, including CRISP technology, pneumatic shutters, and beam attenuators, designed to maximize component lifetime and instrument uptime.
Second-generation PreFIX optical mounting platform enables rapid, tool-free reconfiguration while maintaining highly accurate optical alignment.
Supports both conventional and in-plane diffraction geometries, allowing measurements of lattice planes both parallel and perpendicular to the sample surface.
Flexible optical configurations accommodate a broad range of diffraction experiments for single crystals, polycrystalline materials, thin films, and multilayer structures.

Technology

Parameter	Specification
Technology	X-ray Diffraction (XRD)
Measurement Types	Phase identification, phase quantification, thin-film metrology, residual stress, interface roughness, epitaxy analysis, texture analysis, reciprocal space analysis
Maximum Wafer Diameter	300 mm
Cleanroom Compatibility	ISO 4
SECS/GEM	Supported

Goniometer

Parameter	Specification
Type	Horizontal goniometer
Radius	420 mm
Maximum Usable 2θ Range	-40° to 160° (depending on accessories)
Encoder System	Direct optical encoding system with precisely aligned Heidenhain encoders
Long-Range Accuracy	±0.0025°
Short-Range Accuracy (0.5°)	±0.0004°
Angular Reproducibility	<0.0002°
Minimum Angular Increment	0.0001°

X-ray Source / Detectors / Stages

Parameter	Specification
X-ray Source	Fully ceramic X-ray tubes manufactured under cleanroom conditions
Focus Configuration	Tool-free interchange between line-focus and point-focus modes
Generator	3 kW X-ray generator compatible with current and future X-ray tubes
Detector	Hybrid pixel detector
Detector Pixel Size	55 × 55 μm²
Sample Stage	5-axis cradle with 200 × 200 mm² X-Y translation
Chi Rotation	±92°
Phi Rotation	2 × 360°

Semiconductor and Single-Crystal Wafer Characterization
Enables high-resolution analysis of semiconductor wafers and epitaxial structures, supporting the evaluation of crystal quality, layer thickness, strain, alloy composition, and other structural parameters essential for semiconductor research, process development, and device manufacturing.
Polycrystalline Materials and Thin Film Analysis
Supports phase identification, texture analysis, residual stress measurement, and X-ray reflectometry for polycrystalline coatings, functional thin films, and multilayer materials. Flexible incident beam optics allow the system to accommodate a wide variety of sample types and diffraction experiments.
Ultra-Thin Films, Nanomaterials, and Amorphous Structures
Provides advanced characterization of ultra-thin films, nanostructured materials, and amorphous layers through techniques such as grazing-incidence XRD, in-plane diffraction, reciprocal space mapping, and X-ray reflectometry, helping researchers investigate crystallinity, interface quality, and microstructural evolution.
Materials Research under Non-Ambient Conditions
Can be integrated with non-ambient sample stages to perform automated XRD measurements under controlled temperatures and inert atmospheres, enabling studies of phase transformations, thermal stability, structural evolution, and material behavior during processing or operation.

Its combination of high-resolution diffraction performance, precise wafer mapping, flexible optical configurations, and comprehensive analytical functions enables accurate characterization of crystalline materials, thin films, semiconductor devices, and nanostructured materials, supporting efficient analysis throughout research, product development, process optimization, and failure investigation. Therefore, Malvern Panalytical X'Pert³ MRD XL delivers reliable, high-quality structural characterization services for clients in the semiconductor, electronics, advanced materials, energy, coatings, and industrial manufacturing sectors.

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Malvern ANalytical X'Pert3MRD XL

Malvern ANalytical X'Pert³MRD XL