Wafer Downsizing Service

Inquiry

Through our global network of testing experts and analytical equipment including chromatography (HPLC, GC, GC/MS) and atomic absorption spectroscopy (AAS, GFA, FIAS), Our goal is to provide test services as efficiently as possible to maximize our customers' profits. For more information about our services, contact one of our experts today.

Note: this service is for Research Use Only and Not intended for clinical use.

In the fast-evolving semiconductor industry, wafer downsizing (also known as wafer coring) has become a critical process to meet diverse manufacturing and device integration requirements. Wafer downsizing refers to the precise reduction of a semiconductor wafer's diameter, transforming standard wafers into smaller sizes to adapt to legacy equipment, optimize yield, or enable specialized applications. This service is essential for manufacturers who need to customize wafer dimensions while maintaining the integrity, surface quality, and performance of the semiconductor material. At Alfa Chemistry, we provide comprehensive wafer downsizing solutions. By leveraging advanced cutting, coring, and edge-processing technologies, we ensure that every downsized wafer meets stringent industry standards and customer specifications.

Our wafer downsizing service encompasses a full suite of processing steps:

Wafer Resizing / Coring

We reduce wafers from larger diameters (up to 300mm) to customized smaller sizes, such as 200mm, 150mm, 100mm, or even smaller, depending on customer requirements.
We can extract multiple smaller wafers from larger ones, maximizing usable material and yield.
Both circular and non-standard wafer shapes are supported, including half-wafers and irregular chip-sized wafers.

Edge Chamfering and Polishing

Downsizing introduces mechanical stress at wafer edges, which can lead to cracks or breakage. We perform precise edge chamfering and polishing to strengthen the wafer and prevent damage in downstream processes.

Terrace and Step Processing

For wafers with multi-layer structures or sensitive coatings, we provide low-damage terrace and step processing. This ensures that critical device layers are preserved while achieving the desired wafer size.

Laser Marking and Identification

Each downsized wafer can be laser marked with unique identifiers or batch codes, ensuring traceability throughout manufacturing.

Cleaning and Final Inspection

After downsizing, wafers will undergo advanced cleaning procedures to remove particles and residues.
Final inspection includes dimensional verification, edge profile assessment, and surface quality checks to ensure compliance with SEMI standards.

Our capacities include:

Maximum Wafer Diameter: Up to 300mm
Minimum Downsized Diameter: As small as 50mm (depending on wafer type)
Supported Materials: Silicon, silicon-on-insulator (SOI), SiC, GaAs, and other compound semiconductors
Dimensional Accuracy: Typical diameter tolerance of ±0.05mm for laser-cut wafers, and ±0.20mm for waterjet processed wafers
Wafer Thickness Range: Supports standard to ultra-thin wafers (50µm – 775µm)
Special Capabilities: Ability to process wafers with pre-existing patterns, notches, flats, or delicate coatings, ensuring maximum yield and minimal damage

These capacities enable us to support customers with flexible solutions, ensuring that downsized wafers meet both the mechanical and electrical requirements of downstream processes.

We employ cutting-edge technologies to achieve high-quality wafer downsizing:

Laser Cutdown

Highly precise laser cutting allows wafers to be downsized with minimal mechanical stress.
Ideal for wafers with pre-existing patterns or notches, ensuring accurate orientation is maintained.

Waterjet and Laser Microjet Cutting

Uses a high-pressure deionized water jet guided by a laser to minimize thermal impact and mechanical stress.
Especially suitable for thin, fragile, or coated wafers where traditional cutting may induce cracks or delamination.

Mechanical Coring and Grinding

For larger wafers, mechanical coring followed by precision grinding and polishing ensures controlled diameter reduction and uniform wafer quality.

Why choose us?

Complete Expertise: We handle a wide range of wafer types, including fragile, coated, and compound semiconductors.
High Precision: Tight dimensional tolerances and minimal stress ensure high-quality results.
End-to-End Service: Includes inspection, protection, downsizing, coring, edge treatment, marking, cleaning, and final inspection.
Advanced Technology: Laser, waterjet, and mechanical methods guarantee low defect rates, high yield, and repeatable quality.

Our wafer downsizing service is trusted by leading semiconductor companies because of our commitment to quality, precision, and customer satisfaction. Choosing our wafer downsizing service ensures that your wafers are accurately resized without compromising structural integrity or surface quality, enabling efficient downstream manufacturing and optimized device performance.

For partnership, inquiries, or engineering guidance—our team is ready to support your journey.

Recommendation
Ordering Process
Ask a Question

Do not know how to place an order, please refer to the flow chart shown below.

Submit quotation request

A technical manager will contact you within 24 hours

You will review and approve the final price and place an order

Confirm with you and make the payment

Instruct you to ship your samples and form

Analytic report delivery

If you have questions at any time during the process, just give us a call or send us an email at . We will do all we can to meet your needs.

Online Inquiry

Please fill out the form below and our experts will give you feedback within 36 hours.
If it is urgent, you can contact us directly through the contact information below.
Email:
Contact Information
Company / Organization:
Contact Name:
Title:
Address1:
Address2:
City:
State/Province:
Zip/Postal Code:
Country:
Phone:
Fax:
* Email:
Testing Information
* Type of Test:
* Number of Samples:
* Sample State:
Sample Source:
Test Items:
Other Description:
How Did You Hear About Us:
* Verification Code

KEEP UP TO DATE

Subscribe to our newsletter and follow us on social media