Wafer Dicing Service

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Through our global network of testing experts and analytical equipment including chromatography (HPLC, GC, GC/MS) and atomic absorption spectroscopy (AAS, GFA, FIAS), Our goal is to provide test services as efficiently as possible to maximize our customers' profits. For more information about our services, contact one of our experts today.

Note: this service is for Research Use Only and Not intended for clinical use.

Wafer dicing is a critical manufacturing process in the semiconductor industry, referring to the precise cutting or separation of semiconductor wafers into individual chips (often called dies) which will ultimately power electronics across automotive, consumer electronics, AI, medical devices, and telecommunications systems. After front-end wafer fabrication is completed, dicing becomes the final gateway between a finished wafer and functional packaged ICs. Perfecting this stage requires cutting-edge equipment, optimized process controls, and deep application expertise to safeguard wafer yield, prevent chipping or cracking, and ensure repeatability at scale. At Alfa Chemistry, we combine engineering excellence with advanced manufacturing systems to deliver world-class wafer dicing services for customers worldwide.

We provide full-process wafer dicing solutions for:

Silicon (Si) wafers
Gallium arsenide (GaAs), GaN
Compound semiconductor wafers
CMOS sensors, micro-LED wafers
...

SiC power wafers
Sapphire & glass wafers
MEMS wafers
Ultra-thin wafers (<50 μm)

We provide end-to-end handling, from incoming inspection, cleaning, and tape mounting, to dicing, die sorting, and packaging, ensuring customers benefit from a simplified supply chain with maximum yield retention.

Key capacity highlights include:

Wafer diameter support: 50 mm, 100 mm, 150 mm, 200 mm, 300 mm
Wafer thickness range: <30 μm ultra-thin wafers to >800 μm thick wafers
Ability to support backside metallized wafers, bumped wafers, and TSV wafers
Cutting tolerance control: ±2 μm, ideal for advanced packaging
Kerf width capability: down to 10 μm depending on blade/laser method
TTV (total thickness variation) tolerance processing
High-yield tape selection based on die fragility, size & surface finish
Fully automated dicing lines capable of high-volume daily output
Wafer thinning + dicing combo flow
Low-damage dicing for MEMS / optical wafers
...

We offer several state-of-the-art dicing methods tailored to different wafer types and design rules:

Blade Dicing

The industry-standard method using diamond-coated blades
Ideal for silicon, GaAs, and standard wafer materials
High throughput and cost-efficient for mass production
Customizable kerf width and depth

Laser Dicing

A non-contact cutting method using ultra-short pulsed lasers
Best for brittle or ultra-thin wafers
Reduced chipping and improved die strength
Allows narrow kerf and high-density layout optimization

Stealth Dicing

Advanced internal laser-based scribing
Eliminates surface damage, enabling extremely thin die production
Excellent for wafer-level packaging environments and sensitive MEMS devices

Plasma Dicing

Chemical plasma etching instead of mechanical cutting
Best-in-class yield for ultra-fragile wafers
Optimized for high-density chip designs and 5G/AI applications

Die sorting services we offer

After wafers are diced, dies must be sorted, picked, and placed into trays, waffle packs, tape-and-reel, or custom packaging. To complement our wafer dicing service, we offer die sorting services. Characteristics of the service include:

Automated die pick-and-place
Die inspection and binning
2D/3D visual inspection for cracks, chips, contamination
Die sorting by functionality test data (KGD sorting available)
Custom tray packaging, film frame, or tape-and-reel output

Our die sorting systems are capable of handling ultra-small dies, supporting next-generation semiconductor packaging such as chiplets, micro-LEDs, optical sensors, and MEMS devices.

✨ To learn more details about our die sorting capabilities, please click here.

In the rapidly evolving semiconductor ecosystem, dependable wafer dicing services are essential to transforming wafers into high-performance semiconductor chips. With world-leading technology, reliable capacity, and a yield-focused mindset, we deliver end-to-end wafer handling and die preparation solutions that empower our customers to innovate faster and succeed in global markets.

Partner with us—and experience precision, performance, and semiconductor manufacturing excellence.

Ordering Process
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Analytic report delivery

If you have questions at any time during the process, just give us a call or send us an email at . We will do all we can to meet your needs.

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