Semiconductor Failure Analysis

Professional Semiconductor Failure Analysis Services to Enhance Product Reliability

In the current electronics industry, the performance and reliability of semiconductor devices are directly linked to the quality and competitiveness of electronic products. Therefore, to assist companies in quickly identifying the causes of failures and optimizing their designs and processes, Alfa Chemistry provides professional semiconductor failure analysis services. With years of experience in semiconductor analysis and state-of-the-art testing equipment, our team is dedicated to providing customers with accurate and efficient solutions.

What is Semiconductor Failure Analysis?

Semiconductor Failure Analysis (FA) is a systematic detection and analysis method for finding the root cause of the failure in chips or semiconductor devices during use or testing. This analysis not only enables companies to solve product quality problems but also to provide a scientific basis for new product design and process optimization.

Applicable to:

• Semiconductor manufacturers
• Packaging and testing facilities
• Electronic component companies

Through failure analysis, companies can reduce product return rates, improve yield, and enhance market competitiveness.

Semiconductor Failure Analysis Services

• Common Failure Mode Detection

• Open Circuit and Short Circuit: Electronic component circuit connection is not firm or the component is damaged.
• Thermal Failure and Overvoltage: Thermal failure due to heating or improper heat dissipation; overvoltage due to abnormal external power or transient voltage.
• Electromigration and Interface Degradation: Electromigration may cause conductor structure changes due to the migration of metal ions in the conductor under current; interface degradation may occur due to chemical or physical changes at the interface of materials in the component.

• Analysis Techniques and Methods

• Optical Microscope (OM) Analysis: First check the surface of the chip for defects
• Scanning Electron Microscope (SEM) Inspection: Observe the microstructure and cracks of the component or material with high resolution
• Focused Ion Beam (FIB) Cross-Sectioning and Analysis: Accurately slice out the internal structure of the chip for failure localization
• Energy Dispersive Spectroscopy (EDS/EDX): Elemental composition analysis of materials to determine if there is material contamination or defects
• X-ray Defect Analysis (X-ray, CT): Non-destructive inspection of internal structural defects, voids, or cracks

• Data Reporting and Solutions

• Illustrated Analysis Report: Detailed documentation of failure modes, analysis process, and results.
• Root Cause Failure Analysis: Analysis from materials, process, design to solve the problem.
• Improvement Recommendations and Design Optimization: Solutions are provided to improve product reliability.

Typical Semiconductor Failure Analysis Process

Taking integrated circuit (IC) failure analysis as an example, the overall process generally includes the following key steps:

1. Background Investigation

Before analysis, it is essential to collect critical information related to the chip, including:

• Design parameters: Process node, circuit functionality, etc.
• Failure history: Failure rates during testing stages and relevant anomaly records.
• Operating environment: Working voltage, temperature, and other operational conditions.

2. Non-Destructive Testing

Non-destructive methods are used to preliminarily assess the condition of the chip:

• Visual inspection: Use a microscope to examine the integrity of the package, such as cracks or pin oxidation.
• Electrical testing: Perform IV curve measurements, latch-up tests, and other electrical tests to help locate potential failure points.

3. Chip Decapsulation

Chemical or mechanical methods are used to remove the packaging material, exposing the chip surface while ensuring that the internal structures remain undamaged, preparing it for subsequent microscopic analysis.

4. Microscopic Analysis

Advanced analytical tools are used to pinpoint failures and identify root causes:

• Scanning Electron Microscopy (SEM): Visualize the morphology of metal layers and interconnect structures, for example, whisker growth or electromigration tracks.
• Energy Dispersive Spectroscopy (EDS): Identify potential contaminant elements in the chip, for example, sodium or potassium ions that may be responsible for oxide layer breakdown.
• Focused Ion Beam (FIB) Sample Preparation: Prepare Transmission Electron Microscopy (TEM) samples via precise cutting to analyze interface defects.
• Emission Microscopy (EMMI): Identify leakage or breakdown hotspots.
• Thermal Imaging (OBIRCH): Detect abnormal local current density and identify potential short-circuit paths.

5. Root Cause Analysis

By combining all detection data with observed failure modes, the fundamental cause of the chip failure can be inferred—for example, electrostatic discharge (ESD) damage, voids in metal interconnect layers, or interface cracks.

6. Improvement Recommendations

Based on the analysis results, actionable optimization proposals are provided to clients, including:

• Design optimization: Adding ESD protection circuits, adjusting interconnect layouts, etc.
• Process improvement: Optimizing photolithography alignment, metal deposition processes, and related manufacturing steps.
• Testing protocol adjustments: Enhancing reliability testing procedures to reduce product failure rates.

Semiconductor Failure Analysis Sample Requirements

For accurate and reliable semiconductor failure analysis, providing proper samples is critical. The following requirements should be observed:

1. Sample Quantity

Normally, 3–5 pieces for initial failure analysis is enough. This is to ensure the repeatability and reliability of the analysis result, and at the same time for more complicated failures, we can analyze from multiple samples. If we need to do statistics or verification, we can also ask for more samples.

2. Sample Condition

• Intact packaging: Samples should be as close to their failed state as possible without additional damage.
• Marked failures: If known, mark or provide information on the suspected failure location.
• No cleaning: The failure mark will be destroyed if the sample is cleaned or etched aggressively.

3. Documentation

• For each sample sent, you should provide relevant information including:
• Chip/device specifications: the part number, process node, who made, etc.
• Operating or ambient conditions when it failed: Power, stress (electrical, temperature, mechanical, etc.)
• Failure history or observed symptoms
• Any prior testing or modifications

Our Service Advantages

• Professional Team: Professional analysis engineers with rich project experience
• Advanced Equipment: Professional SEM, FIB, X-ray and other instruments
• Fast Response: Fast sample processing, analysis and reporting
• Privacy and Security: Strict client data and sample privacy protection

These advantages ensure that every analysis is fast, accurate and reliable, helping companies win a competitive advantage in product development and quality control.

Application Cases and Typical Scenarios

Through the analysis of typical scenarios, we help customers have a more comprehensive understanding of product quality, from micro to system level.

Frequently Asked Questions (FAQ)