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Tungsten

Catalog Number
ACM7440337-33
Product Name
Tungsten
Structure
Tungsten
CAS
7440-33-7
  • Product Overview
  • Documentation
  • Usage
Description
insulated wire, 10m, conductor diameter 0.075mm, insulation thickness 0.02mm, PTFE (polytetrafluoroethylene) insulation, 99.9%
Synonyms
W
IUPAC Name
tungsten
Molecular Weight
183.84
Molecular Formula
W
InChI
1S/W,WFKWXMTUELFFGS-UHFFFAOYSA-N
InChI Key
WFKWXMTUELFFGS-UHFFFAOYSA-N
Boiling Point
10701 °F at 760 mm Hg (NIOSH, 2016)
Melting Point
3410 °C (lit.)
Purity
> 99.99%
Density
19.3 (NIOSH, 2016);18.7-19.3 @ 20 °C/4 °C; depends on extent of working.;19.3 g/cm3;19.3
Solubility
Insoluble (NIOSH, 2016);Sol in mixture of nitric acid and hydrofluoric acid;Solubility in water: none;Insoluble
Storage
room temp
Assay
99.95% trace metals basis
Autoignition Temperature
>=100 °C
Color Form
Steel-gray to tin-white metal; body centered cubic structure;CRYSTALLINE FORM GRAY-BLACK, CUBIC;Hard, brittle, steel-gray to tin-white solid.
Complexity
0
Covalently-Bonded Unit Count
1
EC Number
231-143-9
Exact Mass
183.950933g/mol
Formal Charge
0
H-Bond Acceptor
0
H-Bond Donor
0
Heat Of Vaporization
1150 cal/g
Heavy Atom Count
1
ICSC Number
1404
MDL Number
MFCD00011461
MeSH Entry Terms
Tungsten;Wolfram
Monoisotopic Mass
183.950933g/mol
Other Experimental
Very pure tungsten can be cut with hacksaw and forged, spun, drawn, and extruded; impure metal brittle, worked with difficulty;NOT AFFECTED BY SULFUR OR PHOSPHORUS; GOOD ELECTRICAL CONDUCTIVITY;VIGOROUS REACTION WITH BROMINE TRIFLUORIDE, CHLORINE TRIFLUORIDE; REACTION WITH FLUORINE MAY BE INCANDESCENT;Corroded by sea water.;Atomic number: 74; valences 6, 5, 4, 3, 2. Naturally occurring isotopes: 180 (0.135%); 182 (26.4%); 183 (14.4%); 184 (30.6%); 186 (28.4%).;Hardness: 6.5-7.5. Specific heat (20 °C): 0.032 cal/g/deg C; heat of fusion: 44 cal/g; electrical resistivity (20 °C) 5.5 uohm-cm.;Forms trioxide at red heat; not attacked by water; oxidized to dioxide by steam; very stable to acids, attacked only superficially by concn nitric acid or aqua regia; attacked by fluorine at room temp; by chlorine at 250-300 °C giving hexachloride in absence of air and trioxide and oxychloride in presence of air.;Powdered tungsten can be pyropohric under the right conditions. Slowly sol in fused potassium hydroxide in air, in fused sodium carbonate in air, and sol in fused mixture of sodium hydroxide and nitrate.
Rotatable Bond Count
0
RTECS Number
YO7175000
Stability
STABLE IN DRY AIR @ ORDINARY TEMP;OXIDIZES IN AIR & MUST BE PROTECTED @ ELEVATED TEMP
UNII
V9306CXO6G
Unit Size
1 EA
UN Number
3089;1325
Vapor Pressure
0 mm Hg (approx) (NIOSH, 2016);1.97X10-7 mm Hg @ 2,327 °C;0 mmHg (approx)
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
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