CAS 38465-60-0 Copper(II) Tetrafluoroborate (ca. 45% in Water)

Synonyms

Copper(II) tetrafluoroborate(45% in H₂O); ST2412746; Copper tetrafluoroborate; 14735-84-3; EINECS 253-959-4; Copper(II) Tetrafluoroborate; Borate(1-), tetrafluoro-, copper(2+) (2:1); FT-0659273; Cupric fluoroborate; FT-0624059;

IUPAC Name

copper;ditetrafluoroborate;

Molecular Weight

237.153g/mol

Molecular Formula

B2CuF8;

Canonical SMILES

[B-](F)(F)(F)F.[B-](F)(F)(F)F.[Cu+2];

InChI

InChI=1S/2BF4.Cu/c2*2-1(3,4)5;/q2*-1;+2;

InChI Key

HMUNZEYTSRPVBE-UHFFFAOYSA-N;

Density

1.54 at 68 ° F (USCG, 1999);

Complexity

19.1

Covalently-Bonded Unit Count

EC Number

253-959-4

Exact Mass

236.935g/mol

H-Bond Acceptor

Heavy Atom Count

Monoisotopic Mass

236.935g/mol

Topological Polar Surface Area

0A^2

Application

Copper(II) Tetrafluoroborate (ca. 45% in Water) serves multiple purposes across various industries due to its unique chemical properties. This concentrated dark-blue, odorless aqueous solution is primarily used in copper plating and the production of printed circuit boards, offering a reliable method for creating metallic coatings and connections. Additionally, it acts as a crucial intermediate for the formation of homometallic and trinuclear heteroscorpionate complexes that are essential in electronic and magnetic property studies. In chemical synthesis, it plays a significant role by facilitating Diels-Alder reactions and the decomposition of diazo compounds. The compound further extends its utility as a component in fluxing and plating applications, and as a catalyst in resin-bonded abrasives. Its applications also include producing flame retardants, metal treatments, and grain refining agents, as well as enabling the electrolytic generation of boron and preparation of glazing frits. As an oxidizing agent, it reacts with siloxycyclopropanes to form beta acylalkylcopper(II) species, making it valuable for advanced chemical transformations. Despite its versatility, it's important to note that Copper(II) Tetrafluoroborate can corrode some metals, necessitating careful handling and storage.

January 22, 2025

Reliable Copper Plating Solution for Research

Using Alfa Chemistry's Copper(II) Tetrafluoroborate solution in our lab for electronic studies was straightforward. It efficiently facilitated copper plating and Diels-Alder reactions, proving to be a versatile research catalyst.