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Copper

Catalog Number
ACM7440508-9
Product Name
Copper
Structure
Copper
CAS
7440-50-8
  • Product Overview
  • Documentation
  • Usage
Description
insulated wire, 0.1m, conductor diameter 0.1mm, insulation thickness 0.01mm, PTFE (polytetrafluoroethylene) insulation, 99.99%
Synonyms
CHEBI:28694; Copper, rod, 200mm, diameter 2.0mm, as drawn, 99.99+%; Copper, wire reel, 5m, diameter 0.75mm, as drawn, 99.98+%; Copper, rod, 200mm, diameter 9.5mm, hard, 99.9%; Copper, foil, thickness 0.25 mm, length 2 m, purity 99.9%; Copper, foil, thickness 0.15 mm, size 100 x 100 mm, purity 99.9%; Copper powder, 5% in graphite; Copper - O.F.H.C., foil, 5m coil, thickness 0.1mm, hard, 99.95+%; Copper granulated; Copper, foil, thickness 0.038 mm, length 2 m, purity 99.9%;
IUPAC Name
copper
Molecular Weight
63.55
Molecular Formula
Cu
Canonical SMILES
[Cu]
InChI
1S/Cu,RYGMFSIKBFXOCR-UHFFFAOYSA-N
InChI Key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Boiling Point
4703 °F at 760 mm Hg (NIOSH, 2016)
Melting Point
1083.4 °C (lit.)
Density
8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94
Solubility
Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble
Storage
2-8°C
Assay
99.95% trace metals basis
Color Form
Reddish, lustrous, ductile, malleable metal;Red metal; cubic
Complexity
0
Covalently-Bonded Unit Count
1
EC Number
231-159-6
Exact Mass
62.929597g/mol
Formal Charge
0
H-Bond Acceptor
0
H-Bond Donor
0
Heat Of Vaporization
1150 cal/g
Heavy Atom Count
1
ICSC Number
0240
LogP
-0.57 (calculated)
MDL Number
MFCD00010965
MeSH Entry Terms
Copper;Copper 63;Copper-63
Monoisotopic Mass
62.929597g/mol
Odor
Odorless /Copper dusts and mists/
Other Experimental
Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes;Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.;COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.;Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.;ELECTRONEGATIVITY (PAULING SCALE): 1.90;Dissolved readily in nitric acid and hot concentrated sulfuric acids slowly, but only when exposed to the atmosphere.
Rotatable Bond Count
0
RTECS Number
GL5325000
Stability
BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.
Topological Polar Surface Area
0A^2
UNII
789U1901C5
Unit Size
1 EA
UN Number
3089;3077
Vapor Pressure
0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
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